Wuxi Lianqiang Intelligent Equipment Co.,Ltd specializes in the research, development, and manufacturing of processing equipment for semiconductors such as silicon, germanium, gallium arsenide, silicon carbide, as well as sapphire crystals, ceramics, graphite, optics, and quartz materials. We offer customized solutions and automation for cutting, dicing, grinding, slicing, and polishing professional equipment to our customers.

Technical Specifications:

Processing Specifications: 155mmx155mm

Processing Length: ≤700mm

Maximum Line Speed: 50 meters per second

Cutting Method: Downward Material Swinging Cutting

Maximum Swinging Angle: ±12°

Equipment Advantages:

1. The machine base, main spindle box support, vertical feed column, and feed slider are all cast as a unified structure, suitable for high-precision, high-line-speed processing;

2. The spindle motor of the fixed support is a hollow shaft with internal cooling, ensuring stable temperature during prolonged operation and processing accuracy;

3. The fixture adopts a swinging mechanism to ensure oscillating cutting during processing, distributing cutting forces evenly;

4. Siemens motion control system and original motors are employed, ensuring extremely low equipment downtime;

5. Excellent control of surface quality indicators such as TTV, wire marks, chipping, and breakage.