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Silicon, Gallium Arsenide, Indium Phosphide Processing EquipmentSilicon Carbide, Gallium Nitride, Sapphire Processing EquipmentSilicon Parts Processing Equipment

Diamond Wire Truncating Machine

Main Technical Index
 
  • Diameter of crystal rod

    Φ350~Φ600mm

    Circular wire diameter

    ≥0.65mm

  • Processing specification

    350~600mm

    Cutting feed speed

    2~20mm/min

  • Crystal rod length

    200~1500mm

    Compressed air consumption

    <60m³/h

  • Parallelism of crystal rod

    ≤0.5mm

    Equipment overall power

    7kW

  • Crystal rod edge chipping

    ≤5mm

    Equipment weight 

    6t

  • Cutting surface quality

    Ra≤10μm

    Equipment size

    3800*1900*3150mm

Equipment advantage
 

1.Flexible Cutting Options: Can handle various silicon rod diameters (350mm to 600mm).

2.Long Rod Capacity: Supports cutting of long silicon rods (up to 1500mm).

3.Minimal Edge Chipping: Uses adhesive and floating cylinders for better support, reducing edge chipping.

4.High-Speed Cutting: Supports cutting at high speeds (up to 40m/s) while maintaining quality.

5.Superior Surface Quality: Ensures excellent surface quality during ring cutting.

6.Durability and Efficiency: Pneumatic lubrication for all wheels ensure the internal sealing performance and greatly extends the service life of the bearing.

7.Stable structure Design: The welded machine bed offers strong rigidity and stability, ensuring reliable performance.