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Silicon, Gallium Arsenide, Indium Phosphide Processing EquipmentSilicon Carbide, Gallium Nitride, Sapphire Processing EquipmentSilicon Parts Processing Equipment

Numerical Control Surface Grinding Machine

Main Technical Index
 
Parameters/Machine Model LQ015 LQ016 LQ018
Working Table Area 600x300mm 600x300mm 460x200mm
Maximum Left-Right Movement 650mm 700mm 560mm
Maximum Front-Back Movement 350mm 350mm 250mm
Distance from Working Table Surface to Spindle Center 580mm 525/725mm 470mm
Working Table Speed 3-25m/ min 5-25m/ min 5-25m/min
Grinding Wheel Size φ350mmxφ127mmx(20~40mm) φ350mmxφ127mmx(20~40mm) φ205mmxφ31.75mmx(6~20mm)
Spindle Speed 1440r/min 1450r/min 2850r/min
Equipment Dimensions 2450x1750x2150mm 2620x1700x1900mm(Elevated Type 2100mm) 2080x1400x1775mm
Flatness ±0.01mm ±0.01mm ±0.01mm
Parallelism ±0.01mm ±0.01mm ±0.01mm
Equipment Advantages
Machine tool edge

Major components are sourced from well-known brands, ensuring high stability and durability.

Utilizes high-precision P3 grade ball screw transmission for superior accuracy.

Casting is made from high-grade gray cast iron, providing better resistance to bending and torsional stress.

Optional three-level filtration water tank or tape-type filter to maintain clean cutting fluid, improve processing performance and tool life, and reduce environmental pollution.

Hard rail manually scraped, guide rail mating surface treated with plastic fitting, reducing damping coefficient and enhancing machine tool accuracy.

Optional standard, dense, and integrated electromagnetic chucks for versatility.