| Processed Material Size Range | Φ4~12inch / L100mm | Slicing TTV | ≤30μm |
| Average Cutting Speed | 0.3mm/min | Equipment Weight: | 5.5t |
| Number of Cutting Process Steps | ≥30 Steps | Water Tank Volume | 110L |
| Wire Tension | 0~110N(0.25 Wire Tension is 45N) | Equipment Size | 2480*2250*2160mm |
| Wire Speed | 0~30m/S | Equipment Overall Power | 50kw |
| Diamond Wire Diameter | ≥0.18mm | Wire Breakage Rate | ≤1% (Excluding Human Factors, Silicon Material, Wire, Maintenance, etc.) |
1.High Cutting Efficiency: The machine can achieve a stable cutting speed of 30m/s, offering high cutting efficiency and a high output ratio.
2.Multiple Processing Modes: Supports rotating and material oscillating processing modes, better meeting diverse process requirements.
3.Precision Processing: High processing accuracy with the TTV (Total Thickness Variation) of the cut sample ≤ 30μm, significantly exceeding industry standards.
4.Stable Cutting: Capable of stable operation with 0.18mm diamond wire, precise tension control, and excellent material loss management.
5.High Precision Control: Equipped with a controller from INOVANCE Technology and 13 high-precision servo motors to ensure precise operation.
6.Vibration Control: The wire winding system is arranged on both sides of the machine, effectively reducing vibrations and greatly improving processing precision.
7.Durability: The internal protection is made of stainless steel, and the bed is made of cast iron, offering strong rigidity and stable precision.
8. Flexible Size Adjustment: Equipped with a rod extraction function, allowing easy transition from large to small sizes.
9. Convenient Sampling: After taking samples, it can be directly thinned which making crystal characterization simple
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