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Silicon Carbide Diamond Wire Dicing Machine

Main Technical Index
 
Processed Material Size Range Φ4~12inch / L100mm Slicing TTV ≤30μm
Average Cutting Speed 0.3mm/min Equipment Weight: 5.5t
Number of Cutting Process Steps ≥30 Steps Water Tank Volume 110L
Wire Tension 0~110N(0.25 Wire Tension is 45N) Equipment Dimensions 2480x2250x2160mm(Length x Width x Height)
Wire Speed 0~30m/S Total Power of Equipment 50kw
Diamond Wire Diameter ≥0.18mm Wire Breakage Rate ≤1% (Excluding Human Factors, Silicon Material, Wire, Maintenance, etc.)
 
Equipment Advantages
Machine tool edge

1. The equipment can stably cut at a high wire speed of 30m/s, with high cutting efficiency and productivity;

2. The equipment can be machined in the form of rotation and material swing, so as to better meet various requirements of the process;

3. The equipment achieves high processing accuracy, with a TTV mean value of less than 30μm for diced samples, surpassing industry standards;

4. The equipment can stably use 0.18mm diamond wire, with precise tension control and excellent control of wire thinning and material loss;

5. The equipment uses INOVANCE controller and is equipped with 13 high-precision servo motors;

6. The wire-receiving system is arranged on both sides of the equipment to effectively reduce the impact of vibrations and greatly improve processing accuracy;

7.All internal protections are made of stainless steel; The machine tool bed is made of cast iron with good rigidity and stable precision;

8.It has the function of pulling out the rod, changing the large size to the small size;

9.After sampling, it can be thinned directly, which is simple and quick to characterize the crystal.