Processed Material Size Range | Φ4~12inch / L100mm | Slicing TTV | ≤30μm |
Average Cutting Speed | 0.3mm/min | Equipment Weight: | 5.5t |
Number of Cutting Process Steps | ≥30 Steps | Water Tank Volume | 110L |
Wire Tension | 0~110N(0.25 Wire Tension is 45N) | Equipment Dimensions | 2480x2250x2160mm(Length x Width x Height) |
Wire Speed | 0~30m/S | Total Power of Equipment | 50kw |
Diamond Wire Diameter | ≥0.18mm | Wire Breakage Rate | ≤1% (Excluding Human Factors, Silicon Material, Wire, Maintenance, etc.) |
1. The equipment can stably cut at a high wire speed of 30m/s, with high cutting efficiency and productivity;
2. The equipment can be machined in the form of rotation and material swing, so as to better meet various requirements of the process;
3. The equipment achieves high processing accuracy, with a TTV mean value of less than 30μm for diced samples, surpassing industry standards;
4. The equipment can stably use 0.18mm diamond wire, with precise tension control and excellent control of wire thinning and material loss;
5. The equipment uses INOVANCE controller and is equipped with 13 high-precision servo motors;
6. The wire-receiving system is arranged on both sides of the equipment to effectively reduce the impact of vibrations and greatly improve processing accuracy;
7.All internal protections are made of stainless steel; The machine tool bed is made of cast iron with good rigidity and stable precision;
8.It has the function of pulling out the rod, changing the large size to the small size;
9.After sampling, it can be thinned directly, which is simple and quick to characterize the crystal.