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Silicon, Gallium Arsenide, Indium Phosphide Processing EquipmentSilicon Carbide, Gallium Nitride, Sapphire Processing Equipment

Diamond Wire Slicing Machine

Main Technical Index
 
Parameters/ Equipment Model LQQP1570 LQQP2038
Processing Specifications 4~6inch 4~8inch
processing Length ≤700mm ≤380mm
Maximum Wire Speed 3000mm /min 3000mm /min
Number of Main Rollers 2 Rollers 3
Wire Used 0.18~0.25 mm 0.18~0.25 mm
Maximum Swinging Angle ±12° 6-inch ±12° / 8-inch ±8°
Equipment (Length x Width x Height) 4500 x1800 x3100 mm 4400 x2130 x3300 mm
Equipment Weight: About 14t About 15t
Equipment Advantages
Machine tool edge

1、The machine base, spindle box support, vertical feed column, and feed slider are all cast as integral structures, suitable for high-precision, high-speed processing;

2、The wire feeding and spindle motors are both Siemens-branded, ensuring stable temperature during prolonged operation to meet precision requirements;

3、The fixture employs a swing mechanism to ensure even cutting forces through oscillating cutting of the workpiece;

4、Siemens motion control system and original motors are used, resulting in an extremely low wire breakage rate;

5、Surface parameters such as TTV, Warp, Bow, surface lines, edge chipping, added cut, and wire breakage are all well controlled.