Processed Crystal Bar Diameter | 4~8inch |
Processed Crystal Bar Length | ≤400mm |
Ovality | ≤0.05mm |
Taper | ≤±0.05mm |
Surface Finish | Ra0.8-1.0 (According to Grinding Wheel Grit) |
OF Width Head-Tail Deviation | ±0.1mm |
Crystal Orientation Precision | ±15' |
V-NOTCH Depth | 1.00~1.25mm |
V-NOTCH Angle | 89°~93° |
Minimum Table Feed | 0.005mm |
Minimum Feed of Grinding Slide | 0.005mm |
Main Spindle Speed | 0-200r/min Continuously Adjustable |
Table Reciprocating Speed | 4-800mm/min Continuously Adjustable |
Equipment Dimensions | 3600x1620x2150mm |
Total Power of Equipment | 20kW |
Equipment Weight | 4.5t |
Can accommodate processing of 4-8 inch crystals
Processing Length0-400mm
Control system can be Mitsubishi or Omron
Equipped with automatic lubrication system
Outer Circle Grinding
Measurement of Crystal Orientation Angle
Grinding of OF Surface
V-Notch Engraving
Surface Smoothness Ra0.8-1.0
Eccentricity 0.02/400mm
Taper ±0.05/400mm
Radial Precision ±15'
Silicon
LT/LN
Silicon Carbide
Gallium Arsenide