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Silicon, Gallium Arsenide, Indium Phosphide Processing EquipmentSilicon Carbide, Gallium Nitride, Sapphire Processing Equipment

Diamond Wire Squaring Machine

Main Technical Index
 
  • Number of Roots Processed per Blade

    1 root/blade

    Wire Storage Length

    ≤20KM

  • Processing Specifications

    Φ≤550mm

    Idle Moving Speed of Cutting Head

    0~1500m/min

  • Processing Length

    ≤750mm

    Wire Mesh Tension Range

    0~120N

  • Wire Speed

    ≤30m/s

    111

    Wire Breakage Rate

    ≤1% (Excluding Human Factors, Wire, and Non-Equipment Reasons)

  • Wire Diameter/Specification

    0.25~0.42mm/442D、BS60

    Total Power of Equipment

    59.5kW

  • Average Cutting Speed

    5~ 10mm/min

    Equipment Weight

    12t

  • Processing Margin Range

    110~ 230mm

    Equipment Dimensions

    3800x2100x3855mm(Length x Width x Height)

Equipment Advantages
Machine tool edge

1. Two crystal holder devices are arranged on the rotary worktable, allowing for separate positions for processing and loading/unloading through table rotation.;

2. The main bracket of the cutting head adopts a high-rigidity structure, equipped with two main motors, significantly enhancing processing stability;

3. The column slider employs servo drive for vertical movement, with well-built and reliable guide wheel support, reducing the risk of wire breakage;

4. The wire management system is mature and stable, and the take-up wheel outside the online spool adopts a disc-shaped spring to secure the take-up spool with a certain torque;

5. The take-up wheel utilizes a tapered positioning sleeve, ensuring optimal concentricity between the take-up wheel and the wire shaft during loading to the maximum extent.