1. The tension sensor has a range of 30N for higher control precision;

2. Auxiliary slurry pipe patent technology, independent control of main and auxiliary flow rates;

3. Low-inertia lightweight integrated turnover wheel for convenient assembly structure replacement;

4. The system adopts Germany-imported Siemens motion control system and motors;

5. Excellent control of silicon wafer surface quality indicators such as TTV, wire marks, and warpage;

6. Compatible with automatic stick-attach equipment, with a bottom surface in the form of NTC;

7. The equipment is specially designed and manufactured for semiconductor wafer processing, not a photovoltaic conversion machine;

8. Front-end loading method for convenient operation, capable of upgrading to automatic loading conditions;

9. The tension arm has a small weight and overhang, with a wire angle close to 90°, beneficial for wire control;

10. Vertical feed employs a cast-in 4-rail mechanism to reduce TTV at the knife entrance;

11. The wire-receiving system is located on both sides of the equipment, installed on an integral cast base for stable structure;

12. The main spindle adopts angular contact bearings and oil-gas lubrication structure, with cooling supplied by a separate water tank;

13. The equipment base, main spindle box support, wire feed, and wire-receiving bracket are all cast as a unified structure.