Silicon Material Processing Specifications::8 inch / 12 inch
Silicon Material Processing Length:≤450mm
Maximum Line Speed:35m/s
Main Wire Diameter:≥φ0.05mm
TTV(ADE detect):Average value≤10μm
Bow(ADE detect):Average value≤±8μm
WARP(ADE detect):Average value<12μm
Yield Rate:≥97%
Wire Breakage Rate:≤1%(Excluding Non-Equipment Factors)
Equipment overall power:150kW
Equipment weight:15.6t
Equipment overall power: 4750*1950*3000mm
"CTRTHK" "UMTR"
"CLASSNUM" "#" "MAX" "MIN" "MEAN" "DELTA" "MAX_DEV" "STD_DEV" "CV"Total 60 752.54 741.25 746.69 11.29 5.842 1.589 0.213
"BOW3P" "UMTR"
"CLASSNUM" "#" "MAX" "MIN" "MEAN" "DELTA" "MAX_DEV" "STD_DEV" "CV"Total 60 7.16 -0.75 2.34 7.91 4.817 2.082 88.868
"WARP3P" "UMTR"
"CLASSNUM" "#" "MAX" "MIN" "MEAN" "DELTA" "MAX_DEV" "STD_DEV" "CV" Total 60 15.92 6.79 9.70 9.13 6.226 1.635 16.861
"TTV" "UMTR"
"CLASSNUM" "#" "MAX" "MIN" "MEAN" "DELTA" "MAX_DEV" "STD_DEV" "CV"Total 60 9.07 2.43 4.66 6.64 4.405 1.852 39.715
1.High precision: The tension sensor has a high control accuracy.
2.Dual-control: Patented auxiliary slurry tube technology, independent control of main/auxiliary flow rates.
3.Modular lightweight design: Low-inertia lightweight integrated guide wheel for easy assembly replacement.
4.Imported driving system：German-imported SIEMONS motion control system and motor.
5.Great surface quality：Superior control of wafer surface quality including TTV, line trace, curl.
6.Semiconductor-specific equipment：Dedicated to semiconductor wafer processing, not modified from other machine.
7.Convenient loading system: Front-loading design for ease of operation, can upgrade to automatic system.
8.Convenient wire arrangement: The weight and overhanging length of the tension arm are small, and the cable arrangement angle is close to 90 degrees, which makes the cable arrangement control convenient.
9.Stable structure: Feed/take-up systems on both sides, mounted on monoblock casting base.
10.High quality structure: Monoblock cast structure (base, spindle, winding, feed).
WeChat Official Account
