Can meet the processing of 6-8" / 12" silicon wafers;

Processing Length: 600/450mm

Includes silicon bar crystal orientation detection, grinding, OF surface processing, V-NOTCH slot processing - all achievable with full automation.

Single machine achieves full automation processing; automatic loading and unloading, automatic centering, automatic inspection, automatic processing, etc.

Control system is either Mitsubishi or Omron;

Equipped with an automatic lubrication system.

Based on the mature grinding machine structure in the photovoltaic industry, optimized design for silicon wafer grinding in the semiconductor industry.

Integral welded base design;

Fixtures and conveying mechanisms are located above the equipment, facilitating equipment protection and maintenance.