Processing Specifications: 8 inch / 12 inch

Processing Length : 150~2500mm

Wafer Thickness : ≥1. 3mm

Surface Roughness : Ra <3μm

Diamond Wire Diameter : 0.50mm

Cutting Flatness : ≤0.2mm

Operating Line Speed : 2400m/min

Equipment size : 4500x3860x3600mm

Equipment overall power : 9.5kW

Equipment weight: 9t

1.Workpiece Loading: Pushing the loading cart to the robot loading station, then scan the work order code. The robot will transfer the silicon rod to the cutting machine loading platform.

2.Worktable Conveying: Based on the set cutting length, the loading conveyor moves the silicon rod to the processing position for cutting.

3.Cutting Process: The gantry-style cutting head performs head and tail trimming and cuts the rod into different lengths.

4.BLOCK Unloading: The BLOCK is automatically pushed to the unloading station, where it undergoes length measurement and laser marking. Then, the robot picks it up and places it on the unloading cart.

5.Sample Processing: The device is equipped with a proprietary robotic suction cup structure to automatically pick up samples. After the samples are automatically dried, they undergo laser marking and are placed into a sample collection box.

6.Cycle: Repeat the cutting and sample processing steps (2-3-4-5).