Processing Specifications: 8 inch / 12 inch
Processing Length : 150~2500mm
Wafer Thickness : ≥1. 5mm
Surface Roughness : Ra <3μm
Diamond Wire Diameter : 0.50/0.65mm
Cutting Flatness : ≤0.2mm
Operating Line Speed : 1800m/min
Equipment Length x Width x Height : 4500x3860x3600mm
Total Power of Equipment : 9.5kW
Total Weight of Equipment : 9t
1、Silicon wafers are automatically loaded by the gantry robot, equipped with safety protection nets and safety light curtains;
2、The cutting head adopts a gantry double-column structure, providing stable and reliable operation with low failure rate, high cutting efficiency, and precision;
3、The silicon wafers after dicing are automatically conveyed to the unloading area, facilitating unloading and transportation. Customers can opt for a fully automatic unloading device and AGV;
4、The loading conveyor and cutting head movement are equipped with a wireless remote control handle, facilitating left-right and up-down movement for easy replacement of diamond wire and cutting wheel;
5、Optional features include work order scanning and laser marking;
6、Optional robotic automatic sampling device；
7. Optional weighing device.
The loading cart is manually pushed to the robotic loading station, scanned, and the robot conveys the silicon wafer to the dicing machine's loading workbench;
Based on the set dicing length, the loading conveyor moves the silicon wafer to the processing position;
The gantry-style cutting head performs end-to-end dicing and dicing of varying segment lengths;
The diced wafers are automatically pushed to the unloading station. After length measurement and laser marking, the robot picks them up and transfers them to the unloading cart;
The equipment is equipped with a robot suction cup structure featuring proprietary patented technology to automatically extract samples. After drying, the samples are laser-marked and placed in a wafer carrier;
Repeats the sequence of steps 2-3-4-5 for dicing and sample processing.
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