Processing Specifications: 8 inch / 12 inch
Processing Length : 2500mm
Wafer Thickness : ≥1. 3mm
Surface Roughness : Ra <3μm
Diamond Wire Diameter : 0.50/0.65mm
Cutting Flatness : ≤0.2mm
Operating Line Speed : 1800m/min
Equipment Length x Width x Height : 4500x3860x3600mm
Total Power of Equipment : 9.5kW
Total Weight of Equipment : 9t
1、Silicon wafers are automatically loaded by the gantry robot, equipped with safety protection nets and safety light curtains;
2、The cutting head adopts a gantry double-column structure, providing stable and reliable operation with low failure rate, high cutting efficiency, and precision;
3、The silicon wafers after dicing are automatically conveyed to the unloading area, facilitating unloading and transportation. Customers can opt for a fully automatic unloading device;
4、The loading conveyor and cutting head movement are equipped with a wireless remote control handle, facilitating left-right and up-down movement for easy replacement of diamond wire and cutting wheel;
5、Optional features include work order scanning and laser marking;
6、Optional robotic automatic sampling device.
The loading cart is manually pushed to the robotic loading station, scanned, and the robot conveys the silicon wafer to the dicing machine's loading workbench;
Based on the set dicing length, the loading conveyor moves the silicon wafer to the processing position;
The gantry-style cutting head performs end-to-end dicing and dicing of varying segment lengths;
The diced wafers are automatically pushed to the unloading station. After length measurement and laser marking, the robot picks them up and transfers them to the unloading cart;
The equipment is equipped with a robot suction cup structure featuring proprietary patented technology to automatically extract samples. After drying, the samples are laser-marked and placed in a wafer carrier;
Repeats the sequence of steps 2-3-4-5 for dicing and sample processing.
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